| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND SILICON |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, DITITAL, CMOS 1MEGX4DRAM |
| MEMORY CAPACITY | 1MX4 |
| MEMORY DEVICE TYPE | RAM |
| OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM TOTAL SUPPLY |
| TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| TIME RATING PER CHACTERISTIC | 80.0 NANOSECONDS NOMINAL ACCESS |
| CAPITANCE RATING PER CHARACTERISTIC | 7.0 INPUT PICOFARADS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 50.0 MILLIAMPERES NOMINAL OUTPUT |
| III OVERALL LENGTH | 0.665 INCHES MINIMUM AND 0.685 INCHES MAXIMUM |
| III OVERALL HEIGHT | 0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |